Diamond H5 Wafer Handling Robot - Vacuum

Wafer Size
2” (50mm) to 12” (300mm)

Payload
1.2 kg (2.65 lbs)

Encoders
Absolute, 32768 pulse/rev on motor shaft

Motor type
Brushless, low inertia high response

Weight
29.5 kg (65 lbs) without an end-effector

Cleanliness
Class 1 clean room environment compatible

Operating temperatures
50°F-104°F (10°C to 40°C)

Facility requirements
Voltage range
100-120AVC, 200-240VAC

Axis	Motion range	Max Velocity	Max Acceleration	Axis Repeatability
T	>500°	180 °/s	360 °/s2	±0.01°
R	±19.883”	25 inch/s	35 inch/s2	±0.001” (0.025mm)
Z	1.456”	4 inch/s	12 inch/s2	±0.001” (0.025mm)